Infrared Emitting Diode

SSIC’s light-receiving and light-emitting elements, which are the smallest units of an optical sensor, are available in various package types, including surface-mounted, board-mounted, and directional types. Additionally, light-receiving components such as phototransistors, diodes, and IC output types

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Phototransistors

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Tick	Thumbnails	Products	Attributes
		PT100MC0MP Surface mounting leadless type Compact (side view/top view mounting possible)	Output type Single phototransistor Half sensitivity angle ±15 λp (nm) TYP. 900 VCE (V) 20
		PT100MF0MP Visible light cut-off Surface mounting leadless type Compact (side view/top view mounting possible)	Output type Single phototransistor Half sensitivity angle ±15 λp (nm) TYP. 900 VCE (V) 20
		PT100MF1MP Visible light cut-off Surface mounting leadless type with lens Compact (side view/top view mounting possible)	Output type Darlington phototransistor Half sensitivity angle ±15 λp (nm) TYP. 860 VCE (V) 10
		PT4800E0000F Epoxy resin with lens Compact, thin	Output type Single phototransistor Half sensitivity angle ±35 λp (nm) TYP. 800 VCE (V) 20
		PT4800FE000F Visible light cut-off type Epoxy resin with lens Compact, thin	Output type Single phototransistor Half sensitivity angle ±35° λp (nm) TYP. 860 VCE (V) 20
		PT480E00000F Epoxy resin with lens General purpose / Narrow acceptance	Output type Single phototransistor Half sensitivity angle ±13° λp (nm) TYP. 800 VCE (V) 20
		PT480FE0000F Visible light cut-off type Epoxy resin with lens General purpose / Narrow acceptance	Output type Single phototransistor Half sensitivity angle ±13° λp (nm) TYP. 860 VCE (V) 20

PIN Photodiodes

Showing 1 - 4 out of 4

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Tick	Thumbnails	Products	Attributes
		PD100MC0MP	Features Surface mounting leadless type Package (Material) Transparent epoxy resin board with lens Active area (mm2) – Topr (°C) –30 to +85 Isc (µA) MIN. 0.6 λp (nm) TYP. 820 tr, tf (µs) TYP. 0.01
		PD100MF0MP	Features Visible light cut-off epoxy resin board with lens Package (Material) Transparent epoxy resin board with lens Active area (mm2) – Topr (°C) –30 to +85 Isc (µA) MIN. 0.4 λp (nm) TYP. 850 tr, tf (µs) TYP. 0.01
		PD410PI2E00F	Features PIN type Package (Material) Visible light cut-off epoxy resin with condenser (lens) Active area (mm2) 3.31 Topr (°C) –25 to +85 Isc (µA) MIN. 2.5 λp (nm) TYP. 1000 tr, tf (µs) TYP. 0.2
		PD413PI2E00F	Features PIN type IrDA1.0 Package (Material) Visible light cut-off epoxy resin with condenser (lens) Active area (mm2) 3.31 Topr (°C) –25 to +85 Isc (µA) MIN. MIN. 4.5 (TYP. 5.4) λp (nm) TYP. 960 tr, tf (µs) TYP. 0.2