TURNKEY SOLUTION

Socle provides the most competitive customized package assembly services to meet customers’ needs. The service, with sufficient capability, provides various packaging solutions: BGA/QFP/QFN/Flip chip/WLCSP/ SiP/ AiP/AiM/3D Fabric /Others

The best package solution is reached by continually improving the quality of the testing program, design rule, and electrical/thermal simulation. As mature technologies, BGA and QFP have become value added options for customers. Flip chip, WLCSP, and SiP are up-to-date solutions since the package needs evolve quickly.