| Features | Surface mounting |
|---|---|
| Package (Material) | Transparent epoxy resin |
| Active area (mm2) | – |
| Topr (°C) | –30 to +85 |
| Isc (µA) MIN. | 0.6 |
| λp (nm) TYP. | 820 |
| tr, tf (µs) TYP. | 0.01 |
PIN Photodiodes
| Features | Surface mounting |
|---|---|
| Package (Material) | Transparent epoxy resin |
| Active area (mm2) | – |
| Topr (°C) | –30 to +85 |
| Isc (µA) MIN. | 0.6 |
| λp (nm) TYP. | 820 |
| tr, tf (µs) TYP. | 0.01 |