Turnkey Service

Foundry Service

Socle has comprehensive Foundry access including Sharp, TSMC, UMC, Global Foundries, VIS, SMIC, and more. This allows for abundant process options from 0.35um to 28nm and the most advanced 16nm/14nm FinFET processes and beyond. Socle can offer turnkey solutions including tapeout, wafer manufacturing, WAT/CP analysis, corner lot plan, and yield improvement.

Multi-Foundry & MPW Service

By using a mutli-foundry strategy and comprehensive process solutions, Socle can offer competitive Multi Project Wafer (MPW) service or multi-layer mask (MLM) service to minimize customers’ investment in the design validation stage.

Sharp Specific Process Solution

Sharp has over 30 years of abundant experience in LCD Driver IC. Sharp uses fully automatic control in production equipment to shorten TAT. A tunnel track type clean system is used to perfectly separate wafers from contaminations so that customers can receive wafers with high quality.

Product Engineering Service

Product Engineering Service is offered to take product from prototyping to mass production in a timely manner. It also provides coordination among different parts of the manufacturing service by using sophisticated engineering data analysis tools as well as the Tango system and advanced FA (failure analysis) methodology, so as to expedite product time-to-market and time-to-volume.

Reliability Assurance is made by a comprehesive reliability qualification test plan and execution. Continuous improvements are implemented if necessary to satisfy customer’s requirement before mass production. The detailed items and specification are determined by the product field application and the customer’s requirements.

Package Service

Assembly Service

Socle provides the most competitive customized package assembly services to meet customers' needs. The service, with sufficient capability, provides various packaging solutions: BGA / QFP / QFN / Flip chip / WLCSP / SiP / Others

The best package solution is reached by continually improving the quality of the testing program, design rule, and electrical/thermal simulation. As mature technologies, BGA and QFP have become value added options for customers. Flip chip, WLCSP, and SiP are up-to-date solutions since the package needs evolve quickly.

Package Design Introduction

Package Design Capabilities

Service Items	Tools
Substrate Layout	Cadence Allegro APD
Electrical Simulation	Sigrity SI/PI Power SI System SI
Electrical Model Offering	XtractIM
Thermal Simulation	Power DC

SiP Service

With the evolution of consumer electronics and the requirement of smaller sizes, SiP (System in Package) is becoming a better and popular solution for this trend. Different memories, such as flash, DRAM, and DDR2, analog devices, or RF devices are stacked together and integrated with Socle’s SoC. Socle SiP offers state-of-the-art design verification (SI, PI, EMI) closure. Furthermore, Socle SiP service includes SoC pad layout optimization, test strategy, and known good die (KGD) sourcing.

Production Service

Socle’s Headquarters is located in Taiwan which hosts a world-class semiconductor industry. With this unique advantage, Socle has great flexibility and a wide range of choices to customize the best turnkey solution for customers. The geographic advantage also provides the convenience of logistics and helps to shorten the turn-around time.

Our advantages

Socle’s complete service has therefore become customer’s turnkey resource center with multi-solutions. The one-stop-shop convenience greatly helps to shorten customer’s time-to-market. The customized supply chain upon customer’s requests is cost-effective and robust. With schedule control and WIP report monitor, Socle has successfully delivered millions of packaged IC to customers.

Supply chain management

We are based on the long-term and short-term order forecast of the internal business unit, making the production plan and communicate with the supply chain to arrange enough and flexible production capacity to ensure customer demand. Using ERP and supply chain integrated production information , to provide customers with correctly and timely production of information .In ​​logistics, it is possible to provide a convenient drop ship service to save time.

Testing Service

Socle’s turnkey engineering team has vast and valuable experience in customizing testing programs for worldwide customers. The team is specialized in test program development, conversion of mixed-signal, DFT, MBIST, and high speed function test by using a variety of test platforms, which include V93K, J750EX, D10 testers, and more. Every project has its unique testing needs. By collaborating with the design team and suppliers, Socle’s turnkey engineering team is able to deliver a tailor-made and exclusive testing service. Socle’s efforts of developing its own testing program enable more stable yield performance. Coverage extends from simple low end devices to the most complex high end products requiring the full suite of capabilities: DC, Digital, Analog and RF.

TE Business Unit Mapping

TE Project Mapping

Multi-Testing Platform Solution

Multi-testing platform selection with testers of Advantest V93000 SOC Series, Teradyne J750EX and Credence D10 to offer all kinds of testing services, such as C/P, F/T, M/T, and more. Therefore, Socle can offer test program development, engineering verification and mass-production testing service for customers. The testing capability is C/P(Chip Probing), F/T(Final testing), and M/T(Module testing). Socle has released successfully more than 100 projects for customers and produced millions of IC and thousands of wafers. Product applications include ASIC, SoC, Advance MCU, High-speed interface, ADC, DAC, RF…etc. These products have been sold worldwide including Europe, USA, Japan, Russia, Korea, Singapore, China and Taiwan, since 2001.

Testing Technology

Socle engineers can tackle your most complex test programming issues. Depending on your need, we can take on your complete test program development process, working with your designers from design to production, or assist your test engineers in any part of the process. Our experienced team can provide either turnkey or customized test program development solutions.

• Test engineering experienced on High-speed digital, Mixed-signal, RF devices & Power device.
• Digital test pattern data rate up to 400 MHz / 800 Mbps.
• Direct docking probe card & Fine pitch < 80um for Wafer Sorting.
• Merge system circuit to load board for Final Testing.
• Module system testing automation with Module Testing.
• Scalable configurations for RF applications.

Module Testing Solution Service

The requirements of today's SoC/SIP industry for ever higher speeds, performance and pin counts means that test systems must offer greater functionality while maintaining low cost of test. For some special device, you can use a handler to set up preconditions and prepare an initial testing environment for particular tests. For example, your test-plan requires a particular read-write that must be implicitly created before the production is started. You need a system-board, a PC, and a handler. The handler transfers signal to the PC being tested. The data is measurement from a system-board and values from PC.

Test Solution

Socle’s Turnkey Engineering Team has vast and valuable experience in customizing testing programs for worldwide customers. The team is specialized in test program development, conversion of mixed-signal, DFT, MBIST, and high speed function test by using a variety of test platforms, which include V93K, J750, D10 testers, and more. Every project has its unique testing needs. By collaborating with the design service team and suppliers, Socle’s turnkey engineering team is able to deliver a tailor-made and exclusive testing service. Socle’s efforts of developing its own testing program enable more stable yield performance.

• Complete testing solution
• Quick debug ability
• Proactive production management